Utilize este identificador para referenciar este registo:
http://hdl.handle.net/10071/22880
Autoria: | Dolatsha, N. Grave, B. Sawaby, M. Chen, C. Babveyh, A. Kananian, S. Bisognin, A. Luxey, C. Gianesello, F. Costa, J. Fernandes, C. Arbabian, A. |
Editor: | Fujino, L. C. |
Data: | 2017 |
Título próprio: | A compact 130GHz fully packaged point-to-point wireless system with 3D-printed 26dBi lens antenna achieving 12.5Gb/s at 1.55pJ/b/m |
Volume: | 60 |
Paginação: | 306 - 307 |
Título do evento: | 64th IEEE International Solid-State Circuits Conference, ISSCC 2017 |
ISSN: | 2376-8606 |
ISBN: | 978-1-5090-3758-2 |
DOI (Digital Object Identifier): | 10.1109/ISSCC.2017.7870383 |
Resumo: | Low-cost, energy efficient, high-capacity, scalable, and easy-to-deploy point-to-point wireless links at mm-waves find a variety of applications including data intensive systems (e.g., data centers), interactive kiosks, and many emerging applications requiring data pipelines. Operating above 100GHz enables compact low-footprint system solutions that can multiplex Tb/s aggregate rates for dense deployments; therefore competing with wired solution in many aspects including rate and efficiency, but much more flexible for deployment. The focus is on small-footprint fully integrated solutions, which overcome traditional packaging challenges imposed at >100GHz with commercial and low-cost solutions. |
Arbitragem científica: | yes |
Acesso: | Acesso Aberto |
Aparece nas coleções: | IT-CRI - Comunicações a conferências internacionais |
Ficheiros deste registo:
Ficheiro | Descrição | Tamanho | Formato | |
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conferenceobject_43337.pdf | Versão Aceite | 1,64 MB | Adobe PDF | Ver/Abrir |
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