Utilize este identificador para referenciar este registo:
http://hdl.handle.net/10071/22880
Registo completo
Campo DC | Valor | Idioma |
---|---|---|
dc.contributor.author | Dolatsha, N. | - |
dc.contributor.author | Grave, B. | - |
dc.contributor.author | Sawaby, M. | - |
dc.contributor.author | Chen, C. | - |
dc.contributor.author | Babveyh, A. | - |
dc.contributor.author | Kananian, S. | - |
dc.contributor.author | Bisognin, A. | - |
dc.contributor.author | Luxey, C. | - |
dc.contributor.author | Gianesello, F. | - |
dc.contributor.author | Costa, J. | - |
dc.contributor.author | Fernandes, C. | - |
dc.contributor.author | Arbabian, A. | - |
dc.contributor.editor | Fujino, L. C. | - |
dc.date.accessioned | 2021-07-06T11:19:23Z | - |
dc.date.available | 2021-07-06T11:19:23Z | - |
dc.date.issued | 2017 | - |
dc.identifier.isbn | 978-1-5090-3758-2 | - |
dc.identifier.issn | 2376-8606 | - |
dc.identifier.uri | http://hdl.handle.net/10071/22880 | - |
dc.description.abstract | Low-cost, energy efficient, high-capacity, scalable, and easy-to-deploy point-to-point wireless links at mm-waves find a variety of applications including data intensive systems (e.g., data centers), interactive kiosks, and many emerging applications requiring data pipelines. Operating above 100GHz enables compact low-footprint system solutions that can multiplex Tb/s aggregate rates for dense deployments; therefore competing with wired solution in many aspects including rate and efficiency, but much more flexible for deployment. The focus is on small-footprint fully integrated solutions, which overcome traditional packaging challenges imposed at >100GHz with commercial and low-cost solutions. | eng |
dc.language.iso | eng | - |
dc.publisher | IEEE | - |
dc.relation | CNS-1518632 | - |
dc.relation | info:eu-repo/grantAgreement/FCT/5876/147328/PT | - |
dc.rights | openAccess | - |
dc.title | A compact 130GHz fully packaged point-to-point wireless system with 3D-printed 26dBi lens antenna achieving 12.5Gb/s at 1.55pJ/b/m | eng |
dc.type | conferenceObject | - |
dc.event.title | 64th IEEE International Solid-State Circuits Conference, ISSCC 2017 | - |
dc.event.type | Conferência | pt |
dc.event.location | San Francisco, CA, USA | eng |
dc.event.date | 2017 | - |
dc.pagination | 306 - 307 | - |
dc.peerreviewed | yes | - |
dc.journal | 2017 IEEE International Solid-State Circuits Conference (ISSCC) | - |
dc.volume | 60 | - |
degois.publication.firstPage | 306 | - |
degois.publication.lastPage | 307 | - |
degois.publication.location | San Francisco, CA, USA | eng |
degois.publication.title | A compact 130GHz fully packaged point-to-point wireless system with 3D-printed 26dBi lens antenna achieving 12.5Gb/s at 1.55pJ/b/m | eng |
dc.date.updated | 2021-07-06T12:16:22Z | - |
dc.description.version | info:eu-repo/semantics/acceptedVersion | - |
dc.identifier.doi | 10.1109/ISSCC.2017.7870383 | - |
dc.subject.fos | Domínio/Área Científica::Ciências Naturais::Ciências Físicas | por |
iscte.identifier.ciencia | https://ciencia.iscte-iul.pt/id/ci-pub-43337 | - |
iscte.alternateIdentifiers.wos | WOS:000403393800127 | - |
iscte.alternateIdentifiers.scopus | 2-s2.0-85016267140 | - |
Aparece nas coleções: | IT-CRI - Comunicações a conferências internacionais |
Ficheiros deste registo:
Ficheiro | Descrição | Tamanho | Formato | |
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conferenceobject_43337.pdf | Versão Aceite | 1,64 MB | Adobe PDF | Ver/Abrir |
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