Utilize este identificador para referenciar este registo: http://hdl.handle.net/10071/22880
Registo completo
Campo DCValorIdioma
dc.contributor.authorDolatsha, N.-
dc.contributor.authorGrave, B.-
dc.contributor.authorSawaby, M.-
dc.contributor.authorChen, C.-
dc.contributor.authorBabveyh, A.-
dc.contributor.authorKananian, S.-
dc.contributor.authorBisognin, A.-
dc.contributor.authorLuxey, C.-
dc.contributor.authorGianesello, F.-
dc.contributor.authorCosta, J.-
dc.contributor.authorFernandes, C.-
dc.contributor.authorArbabian, A.-
dc.contributor.editorFujino, L. C.-
dc.date.accessioned2021-07-06T11:19:23Z-
dc.date.available2021-07-06T11:19:23Z-
dc.date.issued2017-
dc.identifier.isbn978-1-5090-3758-2-
dc.identifier.issn2376-8606-
dc.identifier.urihttp://hdl.handle.net/10071/22880-
dc.description.abstractLow-cost, energy efficient, high-capacity, scalable, and easy-to-deploy point-to-point wireless links at mm-waves find a variety of applications including data intensive systems (e.g., data centers), interactive kiosks, and many emerging applications requiring data pipelines. Operating above 100GHz enables compact low-footprint system solutions that can multiplex Tb/s aggregate rates for dense deployments; therefore competing with wired solution in many aspects including rate and efficiency, but much more flexible for deployment. The focus is on small-footprint fully integrated solutions, which overcome traditional packaging challenges imposed at >100GHz with commercial and low-cost solutions.eng
dc.language.isoeng-
dc.publisherIEEE-
dc.relationCNS-1518632-
dc.relationinfo:eu-repo/grantAgreement/FCT/5876/147328/PT-
dc.rightsopenAccess-
dc.titleA compact 130GHz fully packaged point-to-point wireless system with 3D-printed 26dBi lens antenna achieving 12.5Gb/s at 1.55pJ/b/meng
dc.typeconferenceObject-
dc.event.title64th IEEE International Solid-State Circuits Conference, ISSCC 2017-
dc.event.typeConferênciapt
dc.event.locationSan Francisco, CA, USAeng
dc.event.date2017-
dc.pagination306 - 307-
dc.peerreviewedyes-
dc.journal2017 IEEE International Solid-State Circuits Conference (ISSCC)-
dc.volume60-
degois.publication.firstPage306-
degois.publication.lastPage307-
degois.publication.locationSan Francisco, CA, USAeng
degois.publication.titleA compact 130GHz fully packaged point-to-point wireless system with 3D-printed 26dBi lens antenna achieving 12.5Gb/s at 1.55pJ/b/meng
dc.date.updated2021-07-06T12:16:22Z-
dc.description.versioninfo:eu-repo/semantics/acceptedVersion-
dc.identifier.doi10.1109/ISSCC.2017.7870383-
dc.subject.fosDomínio/Área Científica::Ciências Naturais::Ciências Físicaspor
iscte.identifier.cienciahttps://ciencia.iscte-iul.pt/id/ci-pub-43337-
iscte.alternateIdentifiers.wosWOS:000403393800127-
iscte.alternateIdentifiers.scopus2-s2.0-85016267140-
Aparece nas coleções:IT-CRI - Comunicações a conferências internacionais

Ficheiros deste registo:
Ficheiro Descrição TamanhoFormato 
conferenceobject_43337.pdfVersão Aceite1,64 MBAdobe PDFVer/Abrir


FacebookTwitterDeliciousLinkedInDiggGoogle BookmarksMySpaceOrkut
Formato BibTex mendeley Endnote Logotipo do DeGóis Logotipo do Orcid 

Todos os registos no repositório estão protegidos por leis de copyright, com todos os direitos reservados.