Please use this identifier to cite or link to this item:
http://hdl.handle.net/10071/22880| Author(s): | Dolatsha, N. Grave, B. Sawaby, M. Chen, C. Babveyh, A. Kananian, S. Bisognin, A. Luxey, C. Gianesello, F. Costa, J. Fernandes, C. Arbabian, A. |
| Editor: | Fujino, L. C. |
| Date: | 2017 |
| Title: | A compact 130GHz fully packaged point-to-point wireless system with 3D-printed 26dBi lens antenna achieving 12.5Gb/s at 1.55pJ/b/m |
| Volume: | 60 |
| Pages: | 306 - 307 |
| Event title: | 64th IEEE International Solid-State Circuits Conference, ISSCC 2017 |
| ISSN: | 2376-8606 |
| ISBN: | 978-1-5090-3758-2 |
| DOI (Digital Object Identifier): | 10.1109/ISSCC.2017.7870383 |
| Abstract: | Low-cost, energy efficient, high-capacity, scalable, and easy-to-deploy point-to-point wireless links at mm-waves find a variety of applications including data intensive systems (e.g., data centers), interactive kiosks, and many emerging applications requiring data pipelines. Operating above 100GHz enables compact low-footprint system solutions that can multiplex Tb/s aggregate rates for dense deployments; therefore competing with wired solution in many aspects including rate and efficiency, but much more flexible for deployment. The focus is on small-footprint fully integrated solutions, which overcome traditional packaging challenges imposed at >100GHz with commercial and low-cost solutions. |
| Peerreviewed: | yes |
| Access type: | Open Access |
| Appears in Collections: | IT-CRI - Comunicações a conferências internacionais |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| conferenceobject_43337.pdf | Versão Aceite | 1,64 MB | Adobe PDF | View/Open |
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