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Title: Condition monitoring system and faults detection for impedance bonds from railway infrastructure
Authors: Andrusca, M.
Adam, M.
Dragomir, A.
Lunca, E.
Seeram, R.
Postolache, O.
Keywords: Return circuit
Monitoring device
Thermal stress
Issue Date: 2020
Publisher: MDPI
Abstract: Nowadays, sensors and condition monitoring systems are expanding rapidly and becoming cheaper. This contributes to increasing developments in condition monitoring in railway transport infrastructure. A condition monitoring system that uses an online device and sensors to acquire electrical parameters from railway infrastructure has been developed and applied for fault detection and diagnosis of impedance bonds. The impedance bond condition is monitored in real-time using current and temperature sensors, providing early warning if predefined thresholds are exceeded in terms of currents, imbalance currents, and temperatures. The proposed method and the developed monitoring device have been validated in the railway laboratory to confirm its capability to detect defects. The acquired parameters from impedance bonds are used to extract thermal stresses and technical conditions of this equipment. Experimental results and appropriate data analysis are included in the article.
Peer reviewed: yes
DOI: 10.3390/app10186167
ISSN: 2076-3417
Accession number: WOS:000580382900001
Appears in Collections:IT-RI - Artigo em revista internacional com arbitragem científica

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