Please use this identifier to cite or link to this item:
http://hdl.handle.net/10071/17036| Author(s): | Lacombe, E. Gianesello, F. Luxey, C. Durand, C. Titz, D. Costa, J. R. Fernandes, C. A. Del-Río, C. Ducournau, G. Gulan, H. Zwick, T. |
| Date: | 2018 |
| Title: | THz packaging solution for low cost si-based 40 Gb/s wireless link system |
| Keywords: | Silicon photonic IC Low-cost antenna in package |
| Abstract: | This paper presents an innovative low-cost transmitter solution aimed at improving telecommunication networks capacities in order to support the massive data traffic growth. Sub-THz frequencies > 200 GHz are considered to target at least 40 Gb/s. The proposed transmitter consists of a Silicon Photonic integrated sub-THz source and an industrial antenna integrated in HDI organic packaging substrate. As these components were experimentally evaluated, a real-time error free wireless data transmission of 10 Gb/s was successfully achieved and an antenna gain of 5.5 dBi was measured in the broadside direction from 220 GHz to 240 GHz (8.7% relative bandwidth). With the addition of a low-cost dielectric lens, a gain of 17 dBi was reached. |
| Peerreviewed: | yes |
| Access type: | Open Access |
| Appears in Collections: | IT-CRI - Comunicações a conferências internacionais |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| 1570406972.pdf | Pós-print | 853,43 kB | Adobe PDF | View/Open |
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