THz packaging solution for low cost si-based 40 Gb/s wireless link system

Abstract

This paper presents an innovative low-cost transmitter solution aimed at improving telecommunication networks capacities in order to support the massive data traffic growth. Sub-THz frequencies > 200 GHz are considered to target at least 40 Gb/s. The proposed transmitter consists of a Silicon Photonic integrated sub-THz source and an industrial antenna integrated in HDI organic packaging substrate. As these components were experimentally evaluated, a real-time error free wireless data transmission of 10 Gb/s was successfully achieved and an antenna gain of 5.5 dBi was measured in the broadside direction from 220 GHz to 240 GHz (8.7% relative bandwidth). With the addition of a low-cost dielectric lens, a gain of 17 dBi was reached.