Please use this identifier to cite or link to this item:
|Title:||THz packaging solution for low cost si-based 40 Gb/s wireless link system|
Costa, J. R.
Fernandes, C. A.
|Keywords:||Silicon photonic IC|
Low-cost antenna in package
|Abstract:||This paper presents an innovative low-cost transmitter solution aimed at improving telecommunication networks capacities in order to support the massive data traffic growth. Sub-THz frequencies > 200 GHz are considered to target at least 40 Gb/s. The proposed transmitter consists of a Silicon Photonic integrated sub-THz source and an industrial antenna integrated in HDI organic packaging substrate. As these components were experimentally evaluated, a real-time error free wireless data transmission of 10 Gb/s was successfully achieved and an antenna gain of 5.5 dBi was measured in the broadside direction from 220 GHz to 240 GHz (8.7% relative bandwidth). With the addition of a low-cost dielectric lens, a gain of 17 dBi was reached.|
|Appears in Collections:||IT-CRI - Comunicações a conferências internacionais|
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.