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Title: THz packaging solution for low cost si-based 40 Gb/s wireless link system
Authors: Lacombe, E.
Gianesello, F.
Luxey, C.
Durand, C.
Titz, D.
Costa, J. R.
Fernandes, C. A.
Del-Río, C.
Ducournau, G.
Gulan, H.
Zwick, T.
Keywords: Silicon photonic IC
Low-cost antenna in package
Issue Date: 2018
Abstract: This paper presents an innovative low-cost transmitter solution aimed at improving telecommunication networks capacities in order to support the massive data traffic growth. Sub-THz frequencies > 200 GHz are considered to target at least 40 Gb/s. The proposed transmitter consists of a Silicon Photonic integrated sub-THz source and an industrial antenna integrated in HDI organic packaging substrate. As these components were experimentally evaluated, a real-time error free wireless data transmission of 10 Gb/s was successfully achieved and an antenna gain of 5.5 dBi was measured in the broadside direction from 220 GHz to 240 GHz (8.7% relative bandwidth). With the addition of a low-cost dielectric lens, a gain of 17 dBi was reached.
Peer reviewed: yes
Appears in Collections:IT-CRI - Comunicações a conferências internacionais

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