Utilize este identificador para referenciar este registo: http://hdl.handle.net/10071/6171
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dc.contributor.authorSilveirinha, Mário G.-
dc.contributor.authorFernandes, Carlos A.-
dc.contributor.authorCosta, Jorge R.-
dc.date.accessioned2014-01-13T17:03:20Z-
dc.date.available2014-01-13T17:03:20Z-
dc.date.issued2008-05-
dc.identifier.citationSilveirinha, M., Fernandes, C., & Costa, J. (2008). Additional boundary condition for a wire medium connected to a metallic surface. New Journal of Physics, 10, 053011. http://dx.doi.org/10.1088/1367-2630/10/5/053011-
dc.identifier.issn1367-2630por
dc.identifier.urihttp://hdl.handle.net/10071/6171-
dc.descriptionWOS:000255793900001 (Nº de Acesso Web of Science)-
dc.description.abstractIn this work, we demonstrate that the interaction of electromagnetic waves with a microstructured material formed by metallic wires connected to a metallic surface can be described using homogenization methods provided an additional boundary condition (ABC) is considered. The ABC is derived by taking into account the specific microstructure of the wire medium. To illustrate the application of the result, we characterize a substrate formed by an array of tilted metallic wires connected to a ground plane, demonstrating that in such a configuration the wire medium behaves essentially as a material with extreme optical anisotropy and that in some circumstances the substrate can be seen as an impedance surface.por
dc.language.isoengpor
dc.publisherIOP Publishingpor
dc.rightsopenAccesspor
dc.titleAdditional boundary condition for a wire medium connected to a metallic surfacepor
dc.typearticle-
dc.pagination053011por
dc.publicationstatusPublicadopor
dc.peerreviewedSimpor
dc.relation.publisherversionThe definitive version is available at: http://dx.doi.org/10.1088/1367-2630/10/5/053011por
dc.journalNew Journal of Physicspor
dc.distributionInternacionalpor
dc.volume10por
dc.subject.fosDomínio/Área Científica::Engenharia e Tecnologia::Engenharia Eletrotécnica, Eletrónica e Informática-
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