Browsing by Author Durand, C.
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| Issue Date | Title | Author(s) | Type | Access Type |
|---|---|---|---|---|
| 2018 | THz packaging solution for low cost si-based 40 Gb/s wireless link system | Lacombe, E.; Gianesello, F.; Luxey, C.; Durand, C.; Titz, D.; Costa, J. R.; Fernandes, C. A.; Del-Río, C.; Ducournau, G.; Gulan, H.; Zwick, T. | Conference Object | Open Access |