A compact 130GHz fully packaged point-to-point wireless system with 3D-printed 26dBi lens antenna achieving 12.5Gb/s at 1.55pJ/b/m

dc.contributor.authorDolatsha, N.
dc.contributor.authorGrave, B.
dc.contributor.authorSawaby, M.
dc.contributor.authorChen, C.
dc.contributor.authorBabveyh, A.
dc.contributor.authorKananian, S.
dc.contributor.authorBisognin, A.
dc.contributor.authorLuxey, C.
dc.contributor.authorGianesello, F.
dc.contributor.authorCosta, J.
dc.contributor.authorFernandes, C.
dc.contributor.authorArbabian, A.
dc.contributor.editorFujino, L. C.
dc.date.accessioned2021-07-06T11:19:23Z
dc.date.available2021-07-06T11:19:23Z
dc.date.issued2017
dc.date.updated2021-07-06T12:16:22Z
dc.description.abstractLow-cost, energy efficient, high-capacity, scalable, and easy-to-deploy point-to-point wireless links at mm-waves find a variety of applications including data intensive systems (e.g., data centers), interactive kiosks, and many emerging applications requiring data pipelines. Operating above 100GHz enables compact low-footprint system solutions that can multiplex Tb/s aggregate rates for dense deployments; therefore competing with wired solution in many aspects including rate and efficiency, but much more flexible for deployment. The focus is on small-footprint fully integrated solutions, which overcome traditional packaging challenges imposed at >100GHz with commercial and low-cost solutions.eng
dc.description.versioninfo:eu-repo/semantics/acceptedVersion
dc.event.date2017
dc.event.locationSan Francisco, CA, USAeng
dc.event.title64th IEEE International Solid-State Circuits Conference, ISSCC 2017
dc.event.typeConferênciapt
dc.identifier.doi10.1109/ISSCC.2017.7870383
dc.identifier.isbn978-1-5090-3758-2
dc.identifier.issn2376-8606
dc.identifier.urihttp://hdl.handle.net/10071/22880
dc.journal2017 IEEE International Solid-State Circuits Conference (ISSCC)
dc.language.isoeng
dc.pagination306 - 307
dc.peerreviewedyes
dc.publisherIEEE
dc.relationCNS-1518632
dc.relationinfo:eu-repo/grantAgreement/FCT/5876/147328/PT
dc.rightsopen access
dc.subject.fosDomínio/Área Científica::Ciências Naturais::Ciências Físicaspor
dc.titleA compact 130GHz fully packaged point-to-point wireless system with 3D-printed 26dBi lens antenna achieving 12.5Gb/s at 1.55pJ/b/meng
dc.typeconferenceObject
dc.volume60
degois.publication.firstPage306
degois.publication.lastPage307
degois.publication.locationSan Francisco, CA, USAeng
degois.publication.titleA compact 130GHz fully packaged point-to-point wireless system with 3D-printed 26dBi lens antenna achieving 12.5Gb/s at 1.55pJ/b/meng
dspace.entity.typePublicationen
iscte.alternateIdentifiers.scopus2-s2.0-85016267140
iscte.alternateIdentifiers.wosWOS:000403393800127
iscte.identifier.cienciahttps://ciencia.iscte-iul.pt/id/ci-pub-43337

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