A compact 130GHz fully packaged point-to-point wireless system with 3D-printed 26dBi lens antenna achieving 12.5Gb/s at 1.55pJ/b/m
| dc.contributor.author | Dolatsha, N. | |
| dc.contributor.author | Grave, B. | |
| dc.contributor.author | Sawaby, M. | |
| dc.contributor.author | Chen, C. | |
| dc.contributor.author | Babveyh, A. | |
| dc.contributor.author | Kananian, S. | |
| dc.contributor.author | Bisognin, A. | |
| dc.contributor.author | Luxey, C. | |
| dc.contributor.author | Gianesello, F. | |
| dc.contributor.author | Costa, J. | |
| dc.contributor.author | Fernandes, C. | |
| dc.contributor.author | Arbabian, A. | |
| dc.contributor.editor | Fujino, L. C. | |
| dc.date.accessioned | 2021-07-06T11:19:23Z | |
| dc.date.available | 2021-07-06T11:19:23Z | |
| dc.date.issued | 2017 | |
| dc.date.updated | 2021-07-06T12:16:22Z | |
| dc.description.abstract | Low-cost, energy efficient, high-capacity, scalable, and easy-to-deploy point-to-point wireless links at mm-waves find a variety of applications including data intensive systems (e.g., data centers), interactive kiosks, and many emerging applications requiring data pipelines. Operating above 100GHz enables compact low-footprint system solutions that can multiplex Tb/s aggregate rates for dense deployments; therefore competing with wired solution in many aspects including rate and efficiency, but much more flexible for deployment. The focus is on small-footprint fully integrated solutions, which overcome traditional packaging challenges imposed at >100GHz with commercial and low-cost solutions. | eng |
| dc.description.version | info:eu-repo/semantics/acceptedVersion | |
| dc.event.date | 2017 | |
| dc.event.location | San Francisco, CA, USA | eng |
| dc.event.title | 64th IEEE International Solid-State Circuits Conference, ISSCC 2017 | |
| dc.event.type | Conferência | pt |
| dc.identifier.doi | 10.1109/ISSCC.2017.7870383 | |
| dc.identifier.isbn | 978-1-5090-3758-2 | |
| dc.identifier.issn | 2376-8606 | |
| dc.identifier.uri | http://hdl.handle.net/10071/22880 | |
| dc.journal | 2017 IEEE International Solid-State Circuits Conference (ISSCC) | |
| dc.language.iso | eng | |
| dc.pagination | 306 - 307 | |
| dc.peerreviewed | yes | |
| dc.publisher | IEEE | |
| dc.relation | CNS-1518632 | |
| dc.relation | info:eu-repo/grantAgreement/FCT/5876/147328/PT | |
| dc.rights | open access | |
| dc.subject.fos | Domínio/Área Científica::Ciências Naturais::Ciências Físicas | por |
| dc.title | A compact 130GHz fully packaged point-to-point wireless system with 3D-printed 26dBi lens antenna achieving 12.5Gb/s at 1.55pJ/b/m | eng |
| dc.type | conferenceObject | |
| dc.volume | 60 | |
| degois.publication.firstPage | 306 | |
| degois.publication.lastPage | 307 | |
| degois.publication.location | San Francisco, CA, USA | eng |
| degois.publication.title | A compact 130GHz fully packaged point-to-point wireless system with 3D-printed 26dBi lens antenna achieving 12.5Gb/s at 1.55pJ/b/m | eng |
| dspace.entity.type | Publication | en |
| iscte.alternateIdentifiers.scopus | 2-s2.0-85016267140 | |
| iscte.alternateIdentifiers.wos | WOS:000403393800127 | |
| iscte.identifier.ciencia | https://ciencia.iscte-iul.pt/id/ci-pub-43337 |
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