Additional boundary condition for a wire medium connected to a metallic surface

dc.contributor.authorSilveirinha, Mário G.
dc.contributor.authorFernandes, Carlos A.
dc.contributor.authorCosta, Jorge R.
dc.date.accessioned2014-01-13T17:03:20Z
dc.date.available2014-01-13T17:03:20Z
dc.date.issued2008-05
dc.descriptionWOS:000255793900001 (Nº de Acesso Web of Science)
dc.description.abstractIn this work, we demonstrate that the interaction of electromagnetic waves with a microstructured material formed by metallic wires connected to a metallic surface can be described using homogenization methods provided an additional boundary condition (ABC) is considered. The ABC is derived by taking into account the specific microstructure of the wire medium. To illustrate the application of the result, we characterize a substrate formed by an array of tilted metallic wires connected to a ground plane, demonstrating that in such a configuration the wire medium behaves essentially as a material with extreme optical anisotropy and that in some circumstances the substrate can be seen as an impedance surface.por
dc.distributionInternacionalpor
dc.identifier.citationSilveirinha, M., Fernandes, C., & Costa, J. (2008). Additional boundary condition for a wire medium connected to a metallic surface. New Journal of Physics, 10, 053011. http://dx.doi.org/10.1088/1367-2630/10/5/053011
dc.identifier.issn1367-2630por
dc.identifier.urihttp://hdl.handle.net/10071/6171
dc.journalNew Journal of Physicspor
dc.language.isoengpor
dc.pagination053011por
dc.peerreviewedSimpor
dc.publicationstatusPublicadopor
dc.publisherIOP Publishingpor
dc.relation.publisherversionThe definitive version is available at: http://dx.doi.org/10.1088/1367-2630/10/5/053011por
dc.rightsopen accesspor
dc.subject.fosDomínio/Área Científica::Engenharia e Tecnologia::Engenharia Eletrotécnica, Eletrónica e Informática
dc.titleAdditional boundary condition for a wire medium connected to a metallic surfacepor
dc.typearticle
dc.volume10por
dspace.entity.typePublicationen

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