Additional boundary condition for a wire medium connected to a metallic surface
| dc.contributor.author | Silveirinha, Mário G. | |
| dc.contributor.author | Fernandes, Carlos A. | |
| dc.contributor.author | Costa, Jorge R. | |
| dc.date.accessioned | 2014-01-13T17:03:20Z | |
| dc.date.available | 2014-01-13T17:03:20Z | |
| dc.date.issued | 2008-05 | |
| dc.description | WOS:000255793900001 (Nº de Acesso Web of Science) | |
| dc.description.abstract | In this work, we demonstrate that the interaction of electromagnetic waves with a microstructured material formed by metallic wires connected to a metallic surface can be described using homogenization methods provided an additional boundary condition (ABC) is considered. The ABC is derived by taking into account the specific microstructure of the wire medium. To illustrate the application of the result, we characterize a substrate formed by an array of tilted metallic wires connected to a ground plane, demonstrating that in such a configuration the wire medium behaves essentially as a material with extreme optical anisotropy and that in some circumstances the substrate can be seen as an impedance surface. | por |
| dc.distribution | Internacional | por |
| dc.identifier.citation | Silveirinha, M., Fernandes, C., & Costa, J. (2008). Additional boundary condition for a wire medium connected to a metallic surface. New Journal of Physics, 10, 053011. http://dx.doi.org/10.1088/1367-2630/10/5/053011 | |
| dc.identifier.issn | 1367-2630 | por |
| dc.identifier.uri | http://hdl.handle.net/10071/6171 | |
| dc.journal | New Journal of Physics | por |
| dc.language.iso | eng | por |
| dc.pagination | 053011 | por |
| dc.peerreviewed | Sim | por |
| dc.publicationstatus | Publicado | por |
| dc.publisher | IOP Publishing | por |
| dc.relation.publisherversion | The definitive version is available at: http://dx.doi.org/10.1088/1367-2630/10/5/053011 | por |
| dc.rights | open access | por |
| dc.subject.fos | Domínio/Área Científica::Engenharia e Tecnologia::Engenharia Eletrotécnica, Eletrónica e Informática | |
| dc.title | Additional boundary condition for a wire medium connected to a metallic surface | por |
| dc.type | article | |
| dc.volume | 10 | por |
| dspace.entity.type | Publication | en |
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